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EPF6024AQC208-3 - Intel

Description: FPGA FLEX 6000 Family 24K Gates 1960 Cells 142.86MHz 0.42um Technology 3.3V 208-Pin PQFP

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PCB Footprints
EPF6024AQC208-3 - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 208-Pin Plastic Quad Flat Pack (PQFP)
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3D Models
EPF6024AQC208-3 - Intel  - 3D model - Quad Flat Packages - 208-Pin Plastic Quad Flat Pack (PQFP)
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EPF6024AQC208-3 Details

  • Manufacturer Part Number:

    EPF6024AQC208-3

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    CAN ALSO BE USED 24000 LOGIC GATES

  • Clock Frequency-Max:

    133 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    171

  • Number of Inputs:

    171

  • Number of Logic Cells:

    1960

  • Number of Outputs:

    171

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4 DEDICATED INPUTS, 171 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Programmable Logic Type:

    LOADABLE PLD

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPF6024AQC208-3 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep signal traces short and away from power planes. Use a decoupling capacitor (e.g., 0.1uF) near the power pin.
  • Use a heat sink with a thermal interface material (TIM) and ensure good airflow. The maximum junction temperature is 100°C. Monitor the device temperature using the built-in thermal diode.
  • Power up the core voltage (VCC) before the auxiliary voltage (VCCAUX). Ensure a monotonic power-up sequence to prevent latch-up. Use a power-on reset (POR) circuit to ensure a clean reset.
  • Use a daisy-chain configuration with each device connected to the previous one. Ensure the TCK frequency is within the recommended range (1-10 MHz). Use a JTAG cable with a 1kΩ pull-up resistor on the TMS line.
  • Follow the I/O banking rules to ensure signal integrity. Assign pins based on the device's I/O standard (e.g., LVCMOS, SSTL). Use the Intel Quartus II software to optimize pin assignment and I/O banking.

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EPF6024AQC208-3 Overview

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Part Image EPF6024AQC208-3N Intel Corporation

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