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EPM1270T144C5N - Intel

Description: EPM1270T144C5N, CPLD MAX II Flash 980 Cells, 116 I/O, 127 Labs, ISP, 2.375 → 3.6 V 144-Pin TQFP

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PCB Footprints
EPM1270T144C5N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144 pin TQFP
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3D Models
EPM1270T144C5N - Intel  - 3D model - Quad Flat Packages - 144 pin TQFP
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EPM1270T144C5N Details

  • Manufacturer Part Number:

    EPM1270T144C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    172.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    116

  • Number of Inputs:

    116

  • Number of Macro Cells:

    980

  • Number of Outputs:

    116

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 116 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

EPM1270T144C5N Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a reliable power supply and ensure that the device is properly powered down before configuration data is stored. Also, use the built-in error correction mechanisms and implement a robust configuration data storage protocol.
  • Use a JTAG controller that supports the IEEE 1149.1 standard, ensure that the device is properly powered and configured, and use a robust testing methodology to minimize false failures.
  • Use the device's power-saving features, such as the low-power mode, and optimize the clock frequency and voltage supply to minimize power consumption. Also, consider using a power-gating technique to reduce power consumption during idle periods.
  • The device is not radiation-hardened, so it's essential to take precautions to mitigate the effects of radiation. Use radiation shielding, error correction mechanisms, and implement a robust fault-tolerant design to ensure reliable operation.

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EPM1270T144C5N Overview

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Part Image EPM1270T144I5N Altera Corporation

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Part Image EPM1270T144A5N Altera Corporation

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Part Image EPM1270T144A5 Intel Corporation

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Part Image EPM1270T144C5 Intel Corporation

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Part Image EPM1270T144A5 Altera Corporation

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For a full list of alternate parts for EPM1270T144C5N, check out Findchips.com