Please enter a minimum 3 letters or numbers
Technical Content
Part Image

EPM2210F324C3 - Intel

Description: CPLD - Complex Programmable Logic Devices The factory is currently not accepting orders for this product.

Download EPM2210F324C3 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
EPM2210F324C3 - Intel - PCB symbol
click to zoom
PCB Footprints
EPM2210F324C3 - Intel PCB footprint - BGA - BGA - 324-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:1.90
click to zoom
3D Models
EPM2210F324C3 - Intel - 3D model - BGA - 324-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:1.90
click to zoom

EPM2210F324C3 Details

  • Manufacturer Part Number:

    EPM2210F324C3

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    19 X 19 MM, 1 MM PITCH, FBGA-324

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    2257 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    272

  • Number of Inputs:

    272

  • Number of Macro Cells:

    1700

  • Number of Outputs:

    272

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 272 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

EPM2210F324C3 Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout and thermal management in the Cyclone II FPGA Development Kit User Guide. It's recommended to follow the guidelines for optimal performance and thermal dissipation.
  • Intel provides guidelines for CDC in the Cyclone II FPGA Clock Domain Crossing User Guide. It's recommended to use synchronizers, FIFOs, or other CDC techniques to ensure data integrity across clock domains.
  • The commercial temperature range for EPM2210F324C3 is 0°C to 85°C, while the industrial temperature range is -40°C to 100°C. However, it's recommended to check the specific temperature range for your application and ensure proper thermal management.
  • Intel provides power optimization techniques in the Cyclone II FPGA Power Management User Guide. Techniques include clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, using the PowerPlay power analysis tool can help identify areas for optimization.
  • The maximum current rating for the I/O banks in EPM2210F324C3 is 25 mA per pin, with a total current limit of 1 A per bank. However, it's recommended to check the specific current requirements for your application and ensure proper current limiting and thermal management.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

EPM2210F324C3 Overview

Use the download button to access the EPM2210F324C3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EPM22, or try a keyword search, such as Programmable Logic Devices

Parts related to EPM2210F324C3

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

EPM2210F324C3 Alternates

Showing results

Image Part Number Model
Part Image EPM2210F324C3N Altera Corporation

Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324
Part Image EPM2210F324C3N Intel Corporation

Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324
Part Image EPM2210F324A3N Intel Corporation

Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324
Part Image EPM2210F324I3N Intel Corporation

Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324
Part Image EPM2210F324A3 Altera Corporation

Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324
For a full list of alternate parts for EPM2210F324C3, check out Findchips.com