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EPM240F100C4N - Intel

Description: CPLD MAX® II Family 192 Macro Cells 247.5MHz 0.18um Technology 2.5V/3.3V 100-Pin TFBGA Tray

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EPM240F100C4N - Intel PCB footprint - BGA - BGA - 100 pin fbga
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EPM240F100C4N - Intel  - 3D model - BGA - 100 pin fbga
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EPM240F100C4N Details

  • Manufacturer Part Number:

    EPM240F100C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    166.6 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    80

  • Number of Inputs:

    80

  • Number of Macro Cells:

    192

  • Number of Outputs:

    80

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 80 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA100,10X10,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    6.1 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

EPM240F100C4N Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCINT first, followed by VCCIO, and then configure the device. This ensures that the internal voltage regulators are powered up correctly.
  • The CCLK should be driven low during power-up to prevent the device from configuring prematurely. Once the power supplies are stable, the CCLK can be driven high to initiate configuration.
  • The maximum frequency for the CCLK is 10 MHz. Exceeding this frequency may cause configuration errors or device damage.
  • To ensure reliable configuration, use a robust configuration clock source, ensure the configuration data is transmitted at a stable frequency, and use a reliable configuration interface (e.g., JTAG or Passive Serial).
  • The recommended termination for the I/O banks is to use a 1 kΩ to 10 kΩ pull-up resistor to VCCIO or a 1 kΩ to 10 kΩ pull-down resistor to GND, depending on the specific application requirements.

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EPM240F100C4N Overview

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