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EPM3032ATI44-10N - Intel

Description: Programmable Logic Device

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EPM3032ATI44-10N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 44-TQFP
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EPM3032ATI44-10N - Intel  - 3D model - Quad Flat Packages - 44-TQFP
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EPM3032ATI44-10N Details

  • Manufacturer Part Number:

    EPM3032ATI44-10N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-44

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    103.1 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    30

  • Number of Inputs:

    34

  • Number of Macro Cells:

    32

  • Number of Outputs:

    10

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 30 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    TQFP44,.47SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.27 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

EPM3032ATI44-10N Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the device away from other heat sources. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable programming and configuration of the device, use a reliable programming tool, such as the Intel Quartus II software, and follow the recommended programming and configuration procedures outlined in the datasheet and user manuals.
  • For power supply decoupling and filtering, use a combination of ceramic and electrolytic capacitors, and consider adding a ferrite bead or a power inductor to filter out high-frequency noise. Place decoupling capacitors close to the device's power pins.
  • Handle the device by the body, avoiding touching the pins or electrical contacts. Store the device in an anti-static bag or wrap it in anti-static material, and avoid exposing it to extreme temperatures, humidity, or physical stress.
  • For signal integrity and termination, use a controlled impedance PCB design, and consider using series termination resistors or Thevenin termination for high-speed signals. Also, ensure that the signal traces are properly routed and matched to minimize reflections and signal degradation.

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EPM3032ATI44-10N Overview

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Part Image EPM3032ATC44-10 Altera Corporation

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Part Image EPM3032ATC44-10 Intel Corporation

EE PLD, 10ns, 32-Cell, CMOS, PQFP44