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EPM3512AQC208-10N - Intel

Description: Programmable Logic Device Family IC CPLD 512MC 10NS 208QFP

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PCB Footprints
EPM3512AQC208-10N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 208-Pin Plastic Quad Flat Pack (PQFP)
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3D Models
EPM3512AQC208-10N - Intel  - 3D model - Quad Flat Packages - 208-Pin Plastic Quad Flat Pack (PQFP)
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EPM3512AQC208-10N Details

  • Manufacturer Part Number:

    EPM3512AQC208-10N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, QFP-208

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    71.94 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    172

  • Number of Inputs:

    172

  • Number of Macro Cells:

    512

  • Number of Outputs:

    168

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 168 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPM3512AQC208-10N Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. Intel provides a reference design guide for PCB layout.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which provides a reset signal to the EPM3512AQC208-10N when the power supply voltage is below a certain threshold.
  • When selecting a clock source, consider the frequency accuracy, jitter, and phase noise requirements of the EPM3512AQC208-10N. A high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), is recommended to ensure reliable operation.
  • To ensure reliable configuration of the EPM3512AQC208-10N during power-up, use a configuration device, such as an EPCS16 or EPCS64, which provides a reliable and secure configuration storage solution.
  • Thermal management considerations for the EPM3512AQC208-10N include providing adequate airflow, using a heat sink or thermal interface material, and ensuring that the device is operated within the recommended temperature range.

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EPM3512AQC208-10N Overview

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Part Image EPM3512AQC208-10 Altera Corporation

EE PLD, 10ns, 512-Cell, CMOS, PQFP208