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EPM570T100C4N - Intel

Description: CPLD, MAX II

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EPM570T100C4N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin Plastic Thin Quad Flat Pack (TQFP)
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EPM570T100C4N - Intel  - 3D model - Quad Flat Packages - 100-Pin Plastic Thin Quad Flat Pack (TQFP)
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EPM570T100C4N Details

  • Manufacturer Part Number:

    EPM570T100C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFP-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    175.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Inputs:

    76

  • Number of Macro Cells:

    440

  • Number of Outputs:

    76

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 76 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

EPM570T100C4N Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCINT first, followed by VCCIO, and then configure the device. This ensures that the internal voltage regulators are powered up correctly.
  • To implement a reliable clock tree, use the dedicated clock networks (GCLK) and follow Intel's guidelines for clock tree design, including using a single clock source, minimizing clock skew, and using clock enable signals to control clock domains.
  • The maximum operating frequency of the EPM570T100C4N is 350 MHz, but this can vary depending on the specific application and design requirements.
  • To optimize power consumption, use Intel's PowerPlay power management technology, which allows you to dynamically adjust power consumption based on system requirements. Additionally, use low-power modes, clock gating, and voltage scaling to minimize power consumption.
  • The EPM570T100C4N has a maximum junction temperature of 100°C. Ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal interface material to manage thermal dissipation.

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EPM570T100C4N Overview

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Part Image EPM570T100I4N Intel Corporation

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Part Image EPM570T100A4 Intel Corporation

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Part Image EPM570T100I4 Intel Corporation

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Part Image EPM570T100I4 Altera Corporation

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For a full list of alternate parts for EPM570T100C4N, check out Findchips.com