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EPM7512AEQC208-10N - Intel

Description: CPLD MAX® 7000A Family 10K Gates 512 Macro Cells 87MHz 3.3V 208-Pin PQFP Tray

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EPM7512AEQC208-10N Details

  • Manufacturer Part Number:

    EPM7512AEQC208-10N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

  • Clock Frequency-Max:

    87 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    176

  • Number of Inputs:

    180

  • Number of Macro Cells:

    512

  • Number of Outputs:

    176

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4 DEDICATED INPUTS, 176 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPM7512AEQC208-10N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout and thermal management in the Cyclone V SoC Development Kit User Guide. Additionally, Intel's Quartus II software provides a PCB synthesis tool to help with layout and routing.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The POR circuit should be designed to meet the device's power-up sequencing requirements.
  • Signal integrity and EMI considerations are critical in high-speed designs. Intel recommends following best practices for signal routing, using differential signaling, and implementing EMI mitigation techniques such as shielding, filtering, and grounding.
  • To optimize power consumption, Intel recommends using the device's power-saving features, such as clock gating, power gating, and dynamic voltage and frequency scaling. Additionally, optimizing the design's clock frequency, voltage, and logic utilization can also help reduce power consumption.
  • Intel provides reliability and availability data for the EPM7512AEQC208-10N in the device's datasheet and reliability report. Designers should consider factors such as FIT rates, MTBF, and MTTR when designing high-reliability systems.

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EPM7512AEQC208-10N Overview

Use the download button to access the EPM7512AEQC208-10N 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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Part Image EPM7512AEQC208-10N Altera Corporation

EE PLD, 10ns, 512-Cell, CMOS, PQFP208

Part Image EPM7512AEQC208-10 Altera Corporation

EE PLD, 10ns, 512-Cell, CMOS, PQFP208