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ES3D-13-F - Diodes Incorporated

Description: Rectifiers 200V 3A

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ES3D-13-F - Diodes Incorporated - PCB symbol
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PCB Footprints
ES3D-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMC
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3D Models
ES3D-13-F - Diodes Incorporated - 3D model - Diodes Moulded - SMC
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ES3D-13-F Details

  • Manufacturer Part Number:

    ES3D-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

ES3D-13-F Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (-40°C to 150°C). Use a thermal interface material (TIM) between the device and heat sink if necessary.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and installation. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • Yes, the ES3D-13-F is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and guidelines for your specific application.
  • Check for proper PCB layout, thermal management, and voltage supply. Verify that the device is operated within the recommended specifications. Use a logic analyzer or oscilloscope to debug signal integrity issues.

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ES3D-13-F Overview

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