ESDS311DYFR footprint, schematic symbol and 3D model by Texas Instruments

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PCB Footprints

ESDS311DYFR - Texas Instruments PCB footprint - Other - Other - DYF0002A

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Part Number ESDS311DYFR
Manufacturer Texas Instruments
Pin Count 2
Part Category TVS Diode (Uni-directional)
Package Category Other
Footprint Name Other - DYF0002A
Released Date Jul 2, 2024
Last Modified Date Jul 2, 2024 4:24 AM UTC
Pinout / Pin List Click Here (Member Only)

ESDS311DYFR Details

Manufacturer Part Number:
ESDS311DYFR
Brand Name:
Texas Instruments
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Texas Instruments
YTEOL:
15
Breakdown Voltage-Max:
7.5 V
Breakdown Voltage-Min:
4.5 V
Breakdown Voltage-Nom:
6 V
Clamping Voltage-Max:
7.7 V
Configuration:
SINGLE, 1 CHANNEL
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-PDSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
3
Non-rep Peak Rev Power Dis-Max:
170 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Reference Standard:
IEC-61000-4-2, 4-4, 4-5
Rep Pk Reverse Voltage-Max:
3.6 V
Reverse Current-Max:
0.05 µA
Reverse Test Voltage:
3.6 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30

ESDS311DYFR Frequently Asked Questions (FAQs)

Texas Instruments recommends a PCB layout with a solid ground plane, short traces, and minimal vias to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated ground plane is recommended for high-frequency applications.
The ESDS311DYFR has a thermal pad that must be connected to a solid ground plane or a thermal relief pattern to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
The ESDS311DYFR is rated for operation from -40°C to 125°C. However, the device's performance may degrade at temperatures above 85°C, and it's recommended to derate the device's power handling accordingly.
Yes, the ESDS311DYFR is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a controlled process to ensure high reliability and low defect rates.
To ensure effective ESD protection, the ESDS311DYFR must be handled and stored in accordance with ESD-sensitive device handling procedures. The device's ESD protection is also dependent on the PCB layout and the quality of the assembly process.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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