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EX256-TQG100I - Microchip

Description: 2.3V ~ 2.7V, -40°C ~ 85°C EX Field Programmable Gate Array (FPGA) IC 81 512 100-LQFP

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EX256-TQG100I - Microchip - PCB symbol
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EX256-TQG100I - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - TQ100
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EX256-TQG100I - Microchip - 3D model - Quad Flat Packages - TQ100
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EX256-TQG100I Details

  • Manufacturer Part Number:

    EX256-TQG100I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    LQFP-100

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    8000 TYPICAL GATES AVAILABLE

  • Clock Frequency-Max:

    250 MHz

  • Combinatorial Delay of a CLB-Max:

    1 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    512

  • Number of Equivalent Gates:

    12000

  • Number of Inputs:

    81

  • Number of Outputs:

    81

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512 CLBS, 12000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 220 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

EX256-TQG100I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal protection and overcurrent protection circuits to prevent damage from overheating or overcurrent conditions.
  • Operating the device at a lower input voltage than recommended may result in reduced performance, while operating at a higher input voltage may reduce the device's lifespan or cause damage. It is recommended to operate the device within the specified input voltage range for optimal performance and reliability.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any signs of oscillation or instability.
  • The device is designed to meet CISPR 22 and FCC Part 15 Class B emissions standards. To minimize EMI, use a shielded enclosure, keep the PCB layout compact, and use EMI filters or shielding on the input and output lines.

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EX256-TQG100I Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like EX256, or try a keyword search, such as Field Programmable Gate Arrays

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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