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F28386DZWTS - Texas Instruments

Description: 32-bit Microcontrollers - MCU C2000 32-bit MCU with connectivity manager, 2x C28x+CLA CPU, 1.5-MB flash, FPU64, CLB, Ethernet 337-NFBGA -40 to 125

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F28386DZWTS - Texas Instruments PCB footprint - BGA - BGA - ZWT (S-PBGA-N337)
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F28386DZWTS - Texas Instruments  - 3D model - BGA - ZWT (S-PBGA-N337)
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F28386DZWTS Details

  • Manufacturer Part Number:

    F28386DZWTS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2020-05-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    ADC CAN BE CONFIGURED TO 12-BIT ALSO

  • Address Bus Width:

    20

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B337

  • JESD-609 Code:

    e1

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    12

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    169

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    337

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA337,19X19,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    346112

  • RAM (words):

    173056

  • ROM (words):

    1572864

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.4 mm

  • Speed:

    200 MHz

  • Supply Current-Max:

    475 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

F28386DZWTS Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the F28386DZWTS is -40°C to 125°C (TJ). However, it's recommended to operate within -40°C to 105°C (TA) for optimal performance and reliability.
  • The clock system on the F28386DZWTS can be configured using the Clock Enable (CKEN) registers, Clock Source Select (CSS) registers, and the PLL (Phase-Locked Loop) control registers. Refer to the device's technical reference manual for detailed information on clock configuration.
  • The maximum frequency of the PWM outputs on the F28386DZWTS is 150 MHz. However, the actual frequency achievable depends on the specific PWM module, clock frequency, and system configuration.
  • Yes, the F28386DZWTS is designed to meet the requirements of safety-critical applications, such as IEC 61508 and ISO 26262. However, it's essential to follow the recommended design and development guidelines, and to consult with TI's safety documentation and experts.
  • The F28386DZWTS supports bootloading through its ROM bootloader. The bootloader can be configured to load code from external memory devices, such as flash or EEPROM. Refer to the device's technical reference manual and application notes for detailed information on bootloading implementation.

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F28386DZWTS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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