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F28P650SH6PTP - Texas Instruments

Description: C28x C2000™ C28x Piccolo™, Functional Safety (FuSa) Microcontroller IC 32-Bit 200MHz 768KB (768K x 8) FLASH 176-HLQFP (24x24)

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PCB Footprints
F28P650SH6PTP - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PTP0176H
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F28P650SH6PTP - Texas Instruments  - 3D model - Quad Flat Packages - PTP0176H
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F28P650SH6PTP Details

  • Manufacturer Part Number:

    F28P650SH6PTP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e4

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    128

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    176

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    253952

  • ROM (words):

    786432

  • ROM Programmability:

    FLASH

  • Screening Level:

    ISO 26262-ASILB

  • Seated Height-Max:

    1.6 mm

  • Speed:

    200 MHz

  • Supply Current-Max:

    400 mA

  • Supply Voltage-Max:

    1.31 V

  • Supply Voltage-Min:

    1.19 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

F28P650SH6PTP Frequently Asked Questions (FAQs)

  • TI recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design guidelines, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The internal voltage regulator has a limited current capability (typically 50 mA) and may not be suitable for powering external circuits. It's recommended to use an external voltage regulator for powering external circuits or high-current applications.
  • A reliable POR circuit can be implemented using an external resistor and capacitor connected to the POR pin. The recommended values are R = 1 kΩ and C = 10 μF. This ensures a clean power-on reset and prevents unwanted resets during power-up.
  • To mitigate EMI and RFI, it's essential to follow proper PCB layout guidelines, use shielding, and implement filtering on the power supply lines. Additionally, consider using a common-mode choke and ferrite beads to reduce emissions.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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