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F3L15R12W2H3_B27 - Infineon

Description: IGBT Modules 3-Phase Inverter VCES = 1200V,15A / ICRM = 30A,145 W ,+/-20 V 0,875 nF -40 150 °C

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F3L15R12W2H3_B27 - Infineon - PCB symbol
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PCB Footprints
F3L15R12W2H3_B27 - Infineon PCB footprint - Other - Other - F3L15R12W2H3_B27-3
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F3L15R12W2H3_B27 - Infineon - 3D model - Other - F3L15R12W2H3_B27-3
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F3L15R12W2H3_B27 Details

  • Manufacturer Part Number:

    F3L15R12W2H3_B27

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    20 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    COMPLEX

  • Gate-Emitter Thr Voltage-Max:

    6.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X34

  • Number of Elements:

    12

  • Number of Terminals:

    34

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    145 W

  • Reference Standard:

    UL APPROVED

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    355 ns

  • Turn-on Time-Nom (ton):

    67 ns

  • VCEsat-Max:

    2.4 V

F3L15R12W2H3_B27 Frequently Asked Questions (FAQs)

  • The thermal resistance (Rth) of the F3L15R12W2H3_B27 is typically around 0.5 K/W (junction to case) and 1.5 K/W (junction to ambient) when mounted on a standard PCB.
  • The F3L15R12W2H3_B27 is rated for operation up to 150°C (Tj), but it's recommended to derate the power dissipation above 125°C to ensure reliable operation and prevent thermal runaway.
  • Proper cooling can be achieved by using a heat sink with a thermal interface material (TIM) and ensuring good airflow around the device. The heat sink should be designed to handle the maximum power dissipation of the device.
  • A good PCB layout for the F3L15R12W2H3_B27 should include a solid ground plane, wide power traces, and a thermal relief pattern around the device to facilitate heat dissipation. Refer to Infineon's application notes for more detailed guidelines.
  • The F3L15R12W2H3_B27 is designed to withstand vibrations up to 10g (according to IEC 60068-2-6), but it's recommended to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB.

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F3L15R12W2H3_B27 Overview

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