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FAM65V05DF1 - onsemi

Description: UL Certified; 27 pin Auto SPM® module; Module serialization for full traceability; 650 V-50A 3-phase IGBT IPM with low loss IGBTs and soft recovery diodes optimized for auxiliary inverter in Hybrid & Electric Vehicle applications; Integrated gate drivers with Internal VS connection, Under Voltage lockout, Over-current shutdown, Temperature Sensing Unit and Fault reporting ; Transfer molded Double Dual Inline Package (DIP) outline; Electrically isolated DBC substrate with low thermal resistance

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FAM65V05DF1 - onsemi PCB footprint - Other - Other - FAM65V05DF1-4
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FAM65V05DF1 - onsemi  - 3D model - Other - FAM65V05DF1-4
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FAM65V05DF1 Details

  • Manufacturer Part Number:

    FAM65V05DF1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP-027

  • Package Description:

    APM-27

  • Manufacturer Package Code:

    MODCB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE(VCC)= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T27

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Output Current-Max:

    150 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    500 V

  • Supply Voltage-Nom (Vsup):

    450 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

FAM65V05DF1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. The datasheet provides a recommended land pattern, but a more detailed layout guide can be found in the onsemi application note AND8321/D.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and airflow management. Additionally, consider using a thermistor or thermocouple to monitor the device temperature and implement thermal protection mechanisms.
  • The current limit of the FAM65V05DF1 (5A) should be considered when designing the system's power distribution and component selection. Ensure that the upstream power supply and downstream components can handle the maximum current rating, and consider adding current limiting or overcurrent protection to prevent damage or failure.
  • The POR and BOR features are designed to ensure the device resets properly during power-up and brown-out conditions. To handle these features, ensure that the power supply is stable and within the recommended voltage range, and consider adding external reset circuitry or a supervisory IC to manage the reset sequence.
  • The FAM65V05DF1 has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or leads to prevent electrostatic discharge.

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FAM65V05DF1 Overview

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