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FDBL0260N100 - onsemi

Description: RoHS Compliant ; UIS Capability ; Max RDS(on) = 2.6 mΩ at VGS = 10 V, ID = 80 A ; Max Qg(tot) = 116 nC at VGS = 10 V, ID = 80 A

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PCB Footprints
FDBL0260N100 - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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3D Models
FDBL0260N100 - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE O
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FDBL0260N100 Details

  • Manufacturer Part Number:

    FDBL0260N100

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Manufacturer Package Code:

    100CU

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    866 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    200 A

  • Drain-source On Resistance-Max:

    0.0026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    60 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    250 W

  • Pulsed Drain Current-Max (IDM):

    1000 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    109 ns

  • Turn-on Time-Max (ton):

    96 ns

FDBL0260N100 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB to further improve thermal performance.
  • The FDBL0260N100 requires a bias voltage of 5V to 15V. Ensure the bias voltage is stable and within the recommended range. A decoupling capacitor of 10nF to 100nF should be placed close to the device to filter out noise and ensure stable operation.
  • The maximum allowable power dissipation for the FDBL0260N100 is 2.5W. Ensure the device is operated within this limit to prevent overheating and damage.
  • Handle the device by the body or use an ESD wrist strap to prevent static buildup. Ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors to protect the device from voltage spikes.
  • Store the device in a dry, cool place away from direct sunlight. The recommended storage temperature is -40°C to 125°C, and the recommended storage humidity is 20% to 80% RH.

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FDBL0260N100 Overview

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