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FDC2512 - onsemi

Description: Last Shipments - Dual N-Channel PowerTrench MOSFET, 30V, 4.6A, 31mΩ

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FDC2512 - onsemi - PCB symbol
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PCB Footprints
FDC2512 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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3D Models
FDC2512 - onsemi - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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FDC2512 Details

  • Manufacturer Part Number:

    FDC2512

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.425 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.8 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC2512 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC2512 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded cable for the USB connection can help reduce EMI.
  • The FDC2512 requires a single 3.3V power supply. Ensure that the power supply is stable and well-regulated. The power sequencing requirement is to power up the VCC pin before the USB_DP and USB_DM pins.
  • The FDC2512 supports USB 2.0 high-speed data transfer rates, which allows for cable lengths up to 3 meters (10 feet) without the need for repeaters or hubs.
  • The FDC2512 has an internal overcurrent protection (OCP) feature that limits the output current to 500mA. However, it is recommended to add external overcurrent protection, such as a polyfuse or a dedicated OCP IC, to protect the device and the system from overcurrent conditions.
  • The FDC2512 has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device and ensure that the PCB is designed to dissipate heat efficiently.

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FDC2512 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like FDC25, or try a keyword search, such as Small Signal Field-Effect Transistors

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