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FDC6327C - onsemi

Description: N-Channel  2.7A, 20V  RDS(on) = 0.08Ω @ VGS = 4.5V  RDS(on) = 0.12Ω @ VGS = 2.5V; SuperSOT™ -6 package: small footprint (72% smallerthan standard SO-8); low profile (1mm thick).; Fast switching speed.; Low gate charge.; High performance trench technology for extremelylow RDS(ON) .; P-Channel  -1.6A, -20V  RDS(on) = 0.17Ω @ VGS = -4.5V  RDS(on) = 0.25Ω @ VGS = -2.5V

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PCB Footprints
FDC6327C - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL_
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FDC6327C - onsemi  - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL_
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FDC6327C Details

  • Manufacturer Part Number:

    FDC6327C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2.7 A

  • Drain-source On Resistance-Max:

    0.08 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.96 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC6327C Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC6327C involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it away from the device can help reduce EMI.
  • To ensure the FDC6327C operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Use thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature below 150°C. Also, ensure the input voltage is within the recommended range of 4.5V to 18V, and the output current does not exceed 2A.
  • The recommended input capacitor value for the FDC6327C is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor such as X5R or X7R is recommended due to its low equivalent series resistance and high reliability.
  • To troubleshoot the FDC6327C, first check the input voltage and ensure it's within the recommended range. Verify that the input capacitor is properly connected and has the correct value. Check the output voltage and current to ensure they're within the recommended range. If the issue persists, check the PCB layout for any signs of EMI or noise, and ensure the device is properly soldered and connected.
  • The FDC6327C is rated for operation up to 125°C, but its performance may degrade at high temperatures. If you need to operate the device in a high-temperature environment, ensure you provide adequate cooling and follow the recommended thermal management techniques to keep the junction temperature below 150°C.

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FDC6327C Overview

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