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FDC6329L - onsemi

Description: Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6KV Human Body Model) ; VDROP=0.2V @ VIN=5V, IL=2.8A. R(ON) = 0.07Ω VDROP=0.2V @ VIN=2.5V, IL=1.9A. R(ON) = 0.105Ω ; High performance PowerTrench™ technology for extremely for superior thermal and electrical capabilities

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Symbol
FDC6329L - onsemi - PCB symbol
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PCB Footprints
FDC6329L - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lea
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3D Models
FDC6329L - onsemi - 3D model - SOT23 (6-Pin) - TSOT23 6−Lea
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FDC6329L Details

  • Manufacturer Part Number:

    FDC6329L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.05

  • Built-in Protections:

    TRANSIENT

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    1.9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.22 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

FDC6329L Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC6329L involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it away from the device can help reduce EMI.
  • To ensure the FDC6329L operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive voltage, current, or temperature, and that the thermal design is adequate to keep the junction temperature below the maximum rating.
  • A low-ESR ceramic capacitor with a value of 10-22uF is recommended for the input of the FDC6329L. This helps to filter out noise and ripple on the input voltage.
  • To troubleshoot issues with the FDC6329L, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for noise or oscillations on the output.
  • Yes, the FDC6329L is suitable for high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard for automotive-grade devices, and its robust design and testing ensure high reliability in demanding environments.

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FDC6329L Overview

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