Part Image

FDC642P-F085PBK - onsemi

Description: Fast switching speed; Qualified to AEC Q101; Typ rDS(on) = 75.3mΩ at VGS = –2.5V, ID = –3.2A; Typ rDS(on) = 52.5mΩ at VGS = –4.5V, ID = –4A; Low gate charge(6.9nC typical) ; RoHS compliant; High performance trench technology for extremely low rDS(on); SuperSOT™–package:small footprint(72% smaller than standard SO–8);low profile(1mm thick).

Download FDC642P-F085PBK Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FDC642P-F085PBK - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lea
click to zoom
3D Models
FDC642P-F085PBK - onsemi  - 3D model - SOT23 (6-Pin) - TSOT23 6−Lea
click to zoom

FDC642P-F085PBK Details

  • Manufacturer Part Number:

    FDC642P-F085PBK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOT-6, 6 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • Avalanche Energy Rating (Eas):

    72 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    1.2 W

  • Power Dissipation-Max (Abs):

    1.2 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    53 ns

  • Turn-on Time-Max (ton):

    23 ns

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FDC642P-F085PBK Overview

Use the download button to access the FDC642P-F085PBK schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FDC64, or try a keyword search, such as Power Field-Effect Transistors

Parts related to FDC642P-F085PBK

Showing 0 results