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FDC8602 - onsemi

Description: High power and current handling capability in a widely used surface mount package ; Fast switching speed ; Max rDS(on) = 575 mΩ at VGS = 6 V, ID = 0.9 A ; RoHS Compliant ; Max rDS(on) = 350 mΩ at VGS = 10 V, ID = 1.2 A ; High performance trench technology for extremely low rDS(on) ; 100% UIL Tested

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FDC8602 - onsemi - PCB symbol
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PCB Footprints
FDC8602 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - sot-23-
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FDC8602 - onsemi - 3D model - SOT23 (6-Pin) - sot-23-
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FDC8602 Details

  • Manufacturer Part Number:

    FDC8602

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    ROHS COMPLIANT, SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    1.2 A

  • Drain-source On Resistance-Max:

    0.35 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    MO-193AA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.96 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC8602 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC8602 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the load. Additionally, using a shielded inductor and keeping the switching node (SW) away from sensitive analog circuits can help minimize EMI.
  • The inductor value for the FDC8602 depends on the input voltage, output voltage, and desired switching frequency. A good starting point is to use the inductor value calculation formula provided in the datasheet, and then adjust based on the specific application requirements.
  • The FDC8602 is rated for an ambient temperature range of -40°C to 125°C. Operating the device outside this range can affect its performance, efficiency, and reliability. It's essential to ensure the device is operated within the specified temperature range to maintain optimal performance.
  • The FDC8602 has a built-in OCP and SCP feature. To implement it, connect the OCP pin to a resistor divider network that sets the current limit threshold. The device will automatically shut down if the current exceeds this threshold. For SCP, connect the SCP pin to a resistor divider network that sets the short-circuit detection threshold.
  • A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 4.7 μF to 10 μF is recommended for the input capacitor. This helps to filter the input voltage and reduce noise.

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FDC8602 Overview

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