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FDC86244 - onsemi

Description: Max rDS(on) = 188 mO at VGS = 6 V, ID = 1.9 A; Max rDS(on) = 144 mΩ at VGS = 10 V, ID = 2.3 A; RoHS Compliant; High performance trench technology for extremely low rDS(on); 100% UIL Tested; High power and current handling capability in a widely used surface mount package; Fast switching speed

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FDC86244 - onsemi - PCB symbol
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PCB Footprints
FDC86244 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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3D Models
FDC86244 - onsemi - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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FDC86244 Details

  • Manufacturer Part Number:

    FDC86244

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    2.3 A

  • Drain-source On Resistance-Max:

    0.144 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    MO-193AA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC86244 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC86244 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power supply, use a low-ESR capacitor (e.g., 10uF) connected between the VIN pin and the GND pin, and a 1uF capacitor connected between the VCC pin and the GND pin. Also, ensure the power supply voltage is within the recommended range of 2.7V to 5.5V.
  • The FDC86244 can sink or source up to 10mA of current per pin, but it's recommended to limit the current to 5mA per pin to ensure reliable operation.
  • To configure the FDC86244 for I2C mode, connect the SCL pin to a clock signal and the SDA pin to a data signal. For SPI mode, connect the SCK pin to a clock signal, the MOSI pin to a data input signal, and the MISO pin to a data output signal. Refer to the datasheet for specific pin connections and configuration details.
  • The FDC86244 can operate up to 50MHz in I2C mode and up to 20MHz in SPI mode, but the actual frequency of operation may be limited by the system's clock speed and the quality of the PCB layout.

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FDC86244 Overview

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