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FDD10N20LZTM - onsemi

Description: Last Shipments - N-Channel Power Trench MOSFET, 150V, 14A, 120mΩ

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PCB Footprints
FDD10N20LZTM - onsemi PCB footprint - Other - Other - DPAK3 6.10x6.54x2.29, 4.57P CASE 369AS ISSUE B_2025-2.9
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3D Models
FDD10N20LZTM - onsemi  - 3D model - Other - DPAK3 6.10x6.54x2.29, 4.57P CASE 369AS ISSUE B_2025-2.9
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FDD10N20LZTM Details

  • Manufacturer Part Number:

    FDD10N20LZTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    121 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    7.6 A

  • Drain-source On Resistance-Max:

    0.38 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    17 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    56 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    180 ns

  • Turn-on Time-Max (ton):

    70 ns

FDD10N20LZTM Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDD10N20LZTM is -55°C to 150°C.
  • To ensure proper biasing, the FDD10N20LZTM requires a gate-source voltage (Vgs) between 2V and 10V, and a drain-source voltage (Vds) between 10V and 200V. Additionally, a gate resistor (Rg) of 1kΩ to 10kΩ is recommended to prevent oscillations.
  • To minimize parasitic inductance, it is recommended to use a compact PCB layout with short, wide traces for the drain and source connections. Additionally, a ground plane underneath the device can help reduce inductance and improve thermal performance.
  • To protect the FDD10N20LZTM from ESD, it is recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-sensitive handling procedures. Additionally, the device should be stored in an anti-static bag or container when not in use.
  • The maximum allowable power dissipation for the FDD10N20LZTM is 125W at a case temperature of 25°C. However, this value can be derated based on the operating temperature and other factors.

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