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FDD4N60NZ - onsemi

Description: ESD improved capability; Improved dv/dt capability; Low gate charge ( Typ. 8.3nC); RDS(on) = 1.9Ω ( Typ.)@ VGS = 10V, ID = 1.7A; RoHS compliant; 100% avalanche tested; Low Crss ( Typ. 3.7pF)

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PCB Footprints
FDD4N60NZ - onsemi PCB footprint - Other - Other - FDD4N60NZ-1
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FDD4N60NZ - onsemi  - 3D model - Other - FDD4N60NZ-1
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FDD4N60NZ Details

  • Manufacturer Part Number:

    FDD4N60NZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    179.2 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    3.4 A

  • Drain-source On Resistance-Max:

    2.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    114 W

  • Pulsed Drain Current-Max (IDM):

    13.6 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD4N60NZ Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDD4N60NZ is -55°C to 150°C.
  • To ensure proper biasing, the gate-source voltage (Vgs) should be between 2V and 10V, and the drain-source voltage (Vds) should be between 0V and 600V.
  • The recommended gate resistor value for the FDD4N60NZ is between 1kΩ and 10kΩ, depending on the specific application and switching frequency.
  • To protect the FDD4N60NZ from overvoltage and overcurrent, use a voltage clamp or a transient voltage suppressor (TVS) diode, and consider adding a current sense resistor and a fuse or a current limiter.
  • The maximum allowable power dissipation for the FDD4N60NZ is 150W, but this can be increased with proper heat sinking and thermal management.

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FDD4N60NZ Overview

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