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FDD6N50FTM - onsemi

Description: 100% avalanche tested; RoHS compliant; Low Crss ( Typ. 6.3pF); Low gate charge ( Typ. 15nC); RDS(on) = 950 mΩ ( Typ.)@ VGS = 10 V, ID = 2.75 A; Improved dv/dt capability

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PCB Footprints
FDD6N50FTM - onsemi PCB footprint - Other - Other - FDD6N50FTM-2
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FDD6N50FTM Details

  • Manufacturer Part Number:

    FDD6N50FTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    270 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    5.5 A

  • Drain-source On Resistance-Max:

    1.15 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    9.5 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    89 W

  • Pulsed Drain Current-Max (IDM):

    22 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    127.7 ns

  • Turn-on Time-Max (ton):

    110.6 ns

FDD6N50FTM Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDD6N50FTM is -55°C to 150°C.
  • To ensure proper biasing, the FDD6N50FTM requires a gate-source voltage (Vgs) between 2V and 10V, and a drain-source voltage (Vds) between 10V and 500V.
  • The recommended gate resistor value for the FDD6N50FTM is between 1kΩ and 10kΩ, depending on the specific application and switching frequency.
  • To protect the FDD6N50FTM from overvoltage and overcurrent, use a voltage clamp or a transient voltage suppressor (TVS) diode, and consider adding a current sense resistor and a fuse or a current limiter.
  • The maximum allowable power dissipation for the FDD6N50FTM is 150W, but this value can be derated based on the operating temperature and other factors.

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