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FDD86113LZ - onsemi

Description: Shielded Gate MOSFET Technology; Max rDS(on) = 104 mΩ at VGS = 10 V, ID = 4.2 A; Max rDS(on) = 156 mΩ at VGS = 4.5 V, ID = 3.4 A; HBM SD Protection Level > 6 kV typical (Note 4); High Performance Trench Technology for Extremely Low rDS(on); High Power and Current Handling Capability in a widely used surface mount package; 100% UIL Tested; RoHS Compliant

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PCB Footprints
FDD86113LZ - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_3
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3D Models
FDD86113LZ - onsemi  - 3D model - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_3
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FDD86113LZ Details

  • Manufacturer Part Number:

    FDD86113LZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    12 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    4.2 A

  • Drain-source On Resistance-Max:

    0.104 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    29 W

  • Pulsed Drain Current-Max (IDM):

    15 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD86113LZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the device away from heat sources and ensure good airflow.
  • Ensure the input voltage is within the recommended range (e.g., 12V ± 10%). Use a stable voltage regulator and decouple the input with a 10uF capacitor.
  • The maximum junction temperature (Tj) is 150°C. Ensure the device is properly cooled to maintain a safe operating temperature.
  • Yes, the FDD86113LZ is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended design and testing guidelines.
  • Use an ESD wrist strap or mat when handling the device. Ensure the PCB has ESD protection diodes and follow proper handling and storage procedures.

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FDD86113LZ Overview

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