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FDD86381-F085 - onsemi

Description: Low RDS(on); AEC−Q101 Qualified and PPAP Capable; Low QG and Capacitance; RoHS Compliant

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PCB Footprints
FDD86381-F085 - onsemi PCB footprint - Other - Other - DPAK3 6.10x6.54x2.29,4.57P CASE 369AS ISSUE B
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3D Models
FDD86381-F085 - onsemi  - 3D model - Other - DPAK3 6.10x6.54x2.29,4.57P CASE 369AS ISSUE B
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FDD86381-F085 Details

  • Manufacturer Part Number:

    FDD86381-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252 3L (DPAK)

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    14 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain-source On Resistance-Max:

    0.021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD86381-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For the FDD86381-F085, the SOA is limited by the maximum voltage rating of 80V, maximum current rating of 3.5A, and maximum power rating of 100W.
  • Handle the device by the body or use an ESD wrist strap. Ensure the PCB has ESD protection components, such as TVS diodes or ESD protection arrays, and follow proper PCB design guidelines for ESD protection.
  • A gate drive voltage of 10-15V and a current of 1-2A is recommended for optimal switching performance. However, the specific requirements may vary depending on the application and PCB layout.

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FDD86381-F085 Overview

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Part Image FDD86381_F085 onsemi

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