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FDD86540 - onsemi

Description: Max rDS(on) = 5 mΩ at VGS = 8 V, ID = 19.5 A; RoHS Compliant; Max rDS(on) = 4.1 mΩ at VGS = 10 V, ID = 21.5 A; 100% UIL tested

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PCB Footprints
FDD86540 - onsemi PCB footprint - Other - Other - FDD86540-1
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FDD86540 - onsemi  - 3D model - Other - FDD86540-1
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FDD86540 Details

  • Manufacturer Part Number:

    FDD86540

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    228 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    21.5 A

  • Drain-source On Resistance-Max:

    0.0041 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    127 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD86540 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The maximum allowable voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and follow proper PCB layout guidelines to minimize ESD susceptibility.
  • The recommended operating frequency range is 100 kHz to 1 MHz, but the device can operate up to 2 MHz with reduced performance.

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FDD86540 Overview

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