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FDG1024NZ - onsemi

Description: Max rDS(on) = 389 mO at VGS = 1.5 V, ID = 0.8 A ; RoHS Compliant ; Max rDS(on) = 215 mO at VGS = 2.5 V, ID = 1.0 A ; HBM ESD protection level >2 kV (Note 3) ; Very low level gate drive requirements allowing operation in 1.5 V circuits (VGS(th) < 1 V) ; Max rDS(on) = 175 mO at VGS = 4.5 V, ID = 1.2 A ; Very small package outline SC70-6 ; Max rDS(on) = 270 mO at VGS = 1.8 V, ID = 0.9 A

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PCB Footprints
FDG1024NZ - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - RBR10T30ANZC9
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FDG1024NZ - onsemi  - 3D model - SOT23 (6-Pin) - RBR10T30ANZC9
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FDG1024NZ Details

  • Manufacturer Part Number:

    FDG1024NZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Package Description:

    ROHS COMPLIANT, SC-70, 6 PIN

  • Manufacturer Package Code:

    419AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.2 A

  • Drain-source On Resistance-Max:

    0.175 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDG1024NZ Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the FDG1024NZ is 100 MHz.
  • To ensure proper biasing, connect VCC to a 3.3V or 5V power supply, and connect VEE to GND. Also, make sure to decouple the power supply lines with capacitors.
  • For optimal performance, use a 4-layer PCB with a solid ground plane, and keep the signal traces short and away from noise sources. Also, use a common mode choke or ferrite bead to filter the power supply lines.
  • The FDG1024NZ has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and a heat sink or a thermal land on the PCB to prevent overheating.
  • The FDG1024NZ has human body model (HBM) ESD protection of ±2 kV and charged device model (CDM) ESD protection of ±500 V.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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FDG1024NZ Overview

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