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FDG327NZ - onsemi

Description: Obsolete - P-Channel 2.5V Specified PowerTrench MOSFET -20 V, -1.5 A, 145 mΩ

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PCB Footprints
FDG327NZ - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC−88 2.00x1.25x0.90, 0.65P CASE 419B−02 ISSUE Z
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3D Models
FDG327NZ - onsemi  - 3D model - SOT23 (6-Pin) - SC−88 2.00x1.25x0.90, 0.65P CASE 419B−02 ISSUE Z
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FDG327NZ Details

  • Manufacturer Part Number:

    FDG327NZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Package Description:

    SC-70, 6 PIN

  • Manufacturer Package Code:

    419B-02

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.5 A

  • Drain-source On Resistance-Max:

    0.09 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.38 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDG327NZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V). Use a stable voltage regulator and decouple the input with a 10uF capacitor.
  • The maximum power dissipation is 1.4W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended range (-40°C to 125°C).
  • Yes, the FDG327NZ is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Handle the device by the body or use an ESD wrist strap during assembly.

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FDG327NZ Overview

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Part Image FDG327NZ_NL Fairchild Semiconductor Corporation

Small Signal Field-Effect Transistor, 1.5A I(D), 20V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET