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FDMA1024NZ - onsemi

Description: Max rDS(on) = 66 mΩ at VGS = 2.5 V, ID = 4.2 A; Max rDS(on) = 82 mΩ at VGS= 1.8 V, ID = 2.3 A; Max rDS(on) = 114 mΩ at VGS = 1.5 V, ID = 2.0 A; Max rDS(on) = 54 mΩ at VGS = 4.5 V, ID = 5.0 A; Low profile - 0.8 mm maximum - in the new packageMicroFET 2x2 mm; HBM ESD protection level = 1.6 kV (Note 3) ; Free from halogenated compounds and antimonyoxides; RoHS Compliant

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PCB Footprints
FDMA1024NZ - onsemi PCB footprint - Other - Other - FDMA1028NZ-1
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3D Models
FDMA1024NZ - onsemi  - 3D model - Other - FDMA1028NZ-1
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FDMA1024NZ Details

  • Manufacturer Part Number:

    FDMA1024NZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    MICROFET-6

  • Manufacturer Package Code:

    511DA

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.054 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    65 pF

  • JEDEC-95 Code:

    MO-229VCCC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.4 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA1024NZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMA1024NZ involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. Also, ensure that the input signals are within the recommended common-mode voltage range of 1.5V to 3.5V.
  • The FDMA1024NZ can operate up to 100 MHz, but the maximum operating frequency may vary depending on the specific application and the quality of the PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • The FDMA1024NZ has a maximum junction temperature of 150°C. To ensure proper thermal management, make sure to provide adequate heat sinking, such as a heat sink or a thermal pad, and ensure good airflow around the device.
  • The recommended input termination for the FDMA1024NZ is 50 ohms, and the recommended output termination is 50 ohms to 75 ohms, depending on the specific application. It's recommended to consult the datasheet and application notes for more information.

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FDMA1024NZ Overview

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