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FDMA1027P - onsemi

Description: RDS(ON) = 160 mΩ @ VGS = -2.5 V ; RDS(ON) = 240 mΩ @ VGS = -1.8 V ; Free from halogenated compounds and antimonyoxides ; RDS(ON) = 120 mΩ @ VGS = -4.5 V ; Low Profile - 0.8 mm maximun - in the new package MicroFET 2x2 mm ; RoHS compliant ; -3.0 A, -20V

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FDMA1027P - onsemi - PCB symbol
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PCB Footprints
FDMA1027P - onsemi PCB footprint - Other - Other - WDFN6 2x2, 0.65P CASE 511DB ISSUE O
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FDMA1027P Details

  • Manufacturer Part Number:

    FDMA1027P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN-6

  • Manufacturer Package Code:

    511DA

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2.2 A

  • Drain-source On Resistance-Max:

    0.12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-229VCCC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.4 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA1027P Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMA1027P involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended operating conditions, including input and output capacitance, and to ensure that the device is operated within its specified voltage and current ranges. Additionally, a stable input voltage and a low-ESR output capacitor can help to maintain stability.
  • The maximum power dissipation of the FDMA1027P is dependent on the ambient temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 1.5W at an ambient temperature of 25°C. However, this value can be derated at higher temperatures.
  • The FDMA1027P is rated for operation up to 125°C, but its performance may degrade at higher temperatures. It's essential to consider the device's thermal characteristics and to ensure that the device is properly heat-sinked to maintain reliable operation.
  • To troubleshoot issues with the FDMA1027P, start by verifying that the device is properly powered and that the input and output voltages are within the specified ranges. Check for any signs of overheating, and ensure that the device is properly heat-sinked. Use an oscilloscope to verify the input and output waveforms, and consult the datasheet and application notes for guidance.

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FDMA1027P Overview

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FDMA1027P Alternates

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Part Image FDMA1027P Fairchild Semiconductor Corporation

Small Signal Field-Effect Transistor, 2.2A I(D), 20V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, MO-229VCCC