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FDMA1032CZ - onsemi

Description: Free from halogenated compounds and antimony oxides ; Low profile – 0.8 mm maximum – in the new package MicroFET 2x2 mm ; Q1: N-Channel 3.7 A, 20V RDS(ON) = 68 mΩ @ VGS = 4.5V RDS(ON) = 86 mΩ @ VGS = 2.5V ; RoHS Compliant ; Q2: P-Channel –3.1 A, –20V RDS(ON) = 95 mΩ @ VGS = –4.5V RDS(ON) = 141 mΩ @ VGS = –2.5V ; HBM ESD protection level > 2 kV (Note 3)

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PCB Footprints
FDMA1032CZ - onsemi PCB footprint - Other - Other - WDFN6 2x2, 0.65P CASE 511DA ISSUE O_1
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FDMA1032CZ - onsemi  - 3D model - Other - WDFN6 2x2, 0.65P CASE 511DA ISSUE O_1
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FDMA1032CZ Details

  • Manufacturer Part Number:

    FDMA1032CZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    MICROFET-6

  • Manufacturer Package Code:

    511DA

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Additional Feature:

    ESD PROTECTION

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.7 A

  • Drain-source On Resistance-Max:

    0.068 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-229

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.4 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA1032CZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMA1032CZ involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 10uF capacitor to ground. The VBIAS pin should be connected to a voltage divider network that sets the desired output voltage. The EN pin should be tied to a logic high or low depending on the desired enable state.
  • The maximum power dissipation of the FDMA1032CZ is 1.4W. However, this can be affected by the operating conditions, such as input voltage, output current, and ambient temperature. It's essential to ensure the device is properly heat-sinked and operated within the recommended operating conditions to prevent overheating.
  • The FDMA1032CZ is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure the device is properly heat-sinked and operated within the recommended operating conditions to prevent overheating and ensure reliable operation.
  • To troubleshoot issues with the FDMA1032CZ, start by verifying the power supply voltage, input signal, and output load. Check for proper PCB layout, decoupling, and heat-sinking. Use an oscilloscope to verify the input and output waveforms, and check for signs of overheating or electrical overstress.

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FDMA1032CZ Overview

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