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FDMA530PZ - onsemi

Description: Max. RDS(on) = 65mΩ at VGS = -4.5V, ID = -5.0A ; Free from halogenated compounds and antimony oxides ; Max. RDS(on) = 35mΩ at VGS = -10V, ID = -6.8A ; HBM ESD protection level > 3k V typical (Note 3) ; Low profile -0.8mm maximum -in the new package MicroFET 2X2 mm ; RoHS compliant

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PCB Footprints
FDMA530PZ - onsemi PCB footprint - Other - Other - MicroFET(2x2)
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FDMA530PZ - onsemi  - 3D model - Other - MicroFET(2x2)
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FDMA530PZ Details

  • Manufacturer Part Number:

    FDMA530PZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    ROHS COMPLIANT, 6 PIN

  • Manufacturer Package Code:

    511CZ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.32

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6.8 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Pulsed Drain Current-Max (IDM):

    24 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

FDMA530PZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For the FDMA530PZ, the SOA is limited by the maximum voltage rating of 30V, maximum current rating of 5A, and maximum power rating of 75W.
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB has ESD protection components such as TVS diodes or ESD protection arrays.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device with care to avoid mechanical stress, and avoid bending or flexing the leads.

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FDMA530PZ Overview

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