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FDMC6686P - onsemi

Description: Max rDS(on) =11.5 mΩ at VGS = -1.8 V, ID = -11 A ; High power and current handling capability in a widely used surface mount package ; Lead-free and RoHS Compliant ; High performance trench technology for extremely low rDS(on) ; Max rDS(on) = 5.7 mΩ at VGS = -2.5 V, ID = -16 A ; Max rDS(on) = 4 mΩ at VGS = -4.5 V, ID = -18 A

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PCB Footprints
FDMC6686P - onsemi PCB footprint - Other - Other - FDMC6686P-1
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3D Models
FDMC6686P - onsemi  - 3D model - Other - FDMC6686P-1
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FDMC6686P Details

  • Manufacturer Part Number:

    FDMC6686P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Manufacturer Package Code:

    483AX

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    56 A

  • Drain-source On Resistance-Max:

    0.004 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2010 pF

  • JEDEC-95 Code:

    MO-240BA

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Pulsed Drain Current-Max (IDM):

    377 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    791 ns

  • Turn-on Time-Max (ton):

    162 ns

FDMC6686P Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowable voltage on the enable pin is 6V, which is the maximum rating for the logic input. Exceeding this voltage may damage the device.
  • Yes, the FDMC6686P is suitable for high-frequency switching applications up to 1 MHz. However, ensure proper PCB layout and decoupling to minimize EMI and ringing.
  • Implement overcurrent protection using a fuse or a current-sensing resistor. Also, use a thermal monitoring circuit to detect overheating and shut down the device if necessary.

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FDMC6686P Overview

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