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FDMC8030 - onsemi

Description: Max rDS(on) = 14 mΩ at VGS = 4.5 V, ID = 10 A ; Max rDS(on) = 28 mΩ at VGS = 3.2 V, ID = 4 A ; Termination is Lead-free and RoHS Compliant ; Max rDS(on) = 10 mΩ at VGS = 10 V, ID = 12 A

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PCB Footprints
FDMC8030 - onsemi PCB footprint - Other - Other - WDFN8 3x3, 0.65P CASE 511DG ISSUE O
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3D Models
FDMC8030 - onsemi  - 3D model - Other - WDFN8 3x3, 0.65P CASE 511DG ISSUE O
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FDMC8030 Details

  • Manufacturer Part Number:

    FDMC8030

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN-8

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511DG

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    75 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    21 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    30 pF

  • JESD-30 Code:

    S-PDSO-N8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    14 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    43 ns

  • Turn-on Time-Max (ton):

    23 ns

FDMC8030 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 5.5V). Use a stable voltage regulator and decouple the input with a 10uF capacitor. Also, ensure the enable pin (EN) is properly biased to VCC or GND.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling. This helps to filter out noise and ensure stable operation.
  • The FDMC8030 has a built-in thermal shutdown feature that activates when the junction temperature exceeds 150°C. Ensure proper heat sinking and thermal design to prevent overheating. If thermal shutdown occurs, the device will automatically recover when the temperature drops below 130°C.
  • Keep the output stage as close to the load as possible. Use a star-configuration for the output traces and ensure they are as short as possible. Also, use a common-mode choke or ferrite bead to filter out high-frequency noise.

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FDMC8030 Overview

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