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FDMC89521L - onsemi

Description: Max rDS(on) = 17 mΩ at VGS = 10 V, ID = 8.2 A ; Max rDS(on) = 27 mΩ at VGS = 4.5 V, ID = 6.7 A ; Termination is Lead-free ; RoHS Compliant

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PCB Footprints
FDMC89521L - onsemi PCB footprint - Other - Other - WDFN8 3x3, 0.65P CASE 511DG ISSUE A__2020
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3D Models
FDMC89521L - onsemi  - 3D model - Other - WDFN8 3x3, 0.65P CASE 511DG ISSUE A__2020
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FDMC89521L Details

  • Manufacturer Part Number:

    FDMC89521L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, POWER 33, MLP, 8 PIN

  • Manufacturer Package Code:

    511DG

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Additional Feature:

    AVALANCHE ENERGY RATED

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    8.2 A

  • Drain-source On Resistance-Max:

    0.017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    S-PDSO-N4

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.9 W

  • Power Dissipation-Max (Abs):

    16 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMC89521L Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Yes, the FDMC89521L is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Check the power supply voltage, ensure proper pin connections, and verify that the device is not overheating. Also, review the application circuit and layout to ensure they meet the recommended design guidelines.

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FDMC89521L Overview

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