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FDMD8900 - onsemi

Description: N-Channel PowerTrench® MOSFET 30V

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FDMD8900 - onsemi  - 3D model
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FDMD8900 Details

  • Manufacturer Part Number:

    FDMD8900

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PQFN-12

  • Package Description:

    QFN-12

  • Manufacturer Package Code:

    483BN

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    73 mJ

  • Case Connection:

    DRAIN SOURCE

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    66 A

  • Drain-source On Resistance-Max:

    0.004 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    75 pF

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    12

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    27 W

  • Pulsed Drain Current-Max (IDM):

    280 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    50 ns

  • Turn-on Time-Max (ton):

    27 ns

FDMD8900 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the FDMD8900 involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
  • To ensure proper biasing, the FDMD8900 requires a stable voltage supply, and the input and output pins should be biased to the recommended voltage levels. The device also requires a proper termination scheme, such as a 50-ohm termination resistor, to ensure signal integrity.
  • The FDMD8900 is rated for operation from -40°C to 125°C, making it suitable for use in a wide range of applications, including automotive and industrial systems.
  • Common issues with the FDMD8900 can often be troubleshooted by checking the PCB layout, ensuring proper biasing and termination, and verifying that the input and output signals are within the recommended specifications. Additionally, checking for noise and interference on the power supply lines and ensuring proper decoupling can also help resolve issues.
  • Yes, the FDMD8900 is designed to meet the requirements of high-reliability applications, including aerospace and medical devices. It is manufactured using a robust process, and onsemi provides a range of reliability and quality data to support its use in these applications.

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FDMD8900 Overview

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