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FDME1024NZT - onsemi

Description: Dual N-Channel Power Trench® MOSFET 20V, 3.8A, 66mΩ

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PCB Footprints
FDME1024NZT - onsemi PCB footprint - Other - Other - MicroFET 1.6x1.6 Thin
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3D Models
FDME1024NZT - onsemi  - 3D model - Other - MicroFET 1.6x1.6 Thin
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FDME1024NZT Details

  • Manufacturer Part Number:

    FDME1024NZT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-6

  • Package Description:

    1.60 X 1.60 MM, HALOGEN FREE AND ROHS COMPLIANT, THIN, MICROFET-6

  • Manufacturer Package Code:

    517DW

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Additional Feature:

    ESD PROTECTION

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.8 A

  • Drain-source On Resistance-Max:

    0.066 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDME1024NZT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures.
  • Handle the device in an ESD-protected environment, use wrist straps or mats, and follow standard ESD handling procedures to prevent damage.
  • Yes, the FDME1024NZT is AEC-Q101 qualified and suitable for high-reliability and automotive applications, but ensure compliance with relevant industry standards and regulations.
  • Use a logic analyzer or oscilloscope to monitor signals, check for proper power supply and decoupling, and consult the datasheet and application notes for troubleshooting guidelines.

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FDME1024NZT Overview

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