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FDME1034CZT - onsemi

Description: Q1: N-Channel Max. RDS(on) = 66 mΩ at VGS = 4.5 V, ID = 3.4A Max. RDS(on) = 86 mΩ at VGS = 2.5 V, ID = 2.9A Max. RDS(on) = 113 mΩ at VGS = 1.8 V, ID = 2.5A Max. RDS(on) = 160 mΩ at VGS= 1.5 V, ID = 2.1A; Free from halogenated compounds and antimony oxides ; Low profile: 0.55 mm maximum in the new package MicroFET 1.6x1.6 Thin; HBM ESD protection level > 1600V (see datasheet Note 3); Q2: P-Channel Max. RDS(on) = 142 mΩ at VGS = -4.5 V, ID = -2.3A Max. RDS(on) = 213 mΩ at VGS = -2.5 V, ID = -1.8A Max. RDS(on)

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FDME1034CZT - onsemi PCB footprint - Other - Other - UDFN6_CASE 517DW
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FDME1034CZT - onsemi  - 3D model - Other - UDFN6_CASE 517DW
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FDME1034CZT Details

  • Manufacturer Part Number:

    FDME1034CZT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UDFN-6

  • Package Description:

    MICROFET-6

  • Manufacturer Package Code:

    517DW

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Additional Feature:

    ESD PROTECTION

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.8 A

  • Drain-source On Resistance-Max:

    0.066 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDME1034CZT Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the switching frequency is within the recommended range (up to 1 MHz). Also, consider the device's power losses, thermal performance, and PCB layout to minimize electromagnetic interference (EMI).
  • Use a voltage regulator or a transient voltage suppressor (TVS) to protect against overvoltage. For overcurrent protection, use a fuse or a current-sensing resistor with a shutdown circuit.

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