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FDMS3572 - onsemi

Description: Low Miller Charge ; Max rDS(on) = 24 mΩ at VGS = 6 V, ID = 8.4 A; RoHS Compliant ; Max rDS(on) = 16.5 mΩ at VGS = 10 V, ID = 8.8 A; Optimized efficiency at high frequencies ; Typ Qg = 28 nC at VGS = 10 V

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PCB Footprints
FDMS3572 - onsemi PCB footprint - Other - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O_1
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3D Models
FDMS3572 - onsemi  - 3D model - Other - WDFN8 5x6, 1.27P CASE 506DP ISSUE O_1
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FDMS3572 Details

  • Manufacturer Part Number:

    FDMS3572

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    ROHS COMPLIANT, 8 PIN

  • Manufacturer Package Code:

    506DP

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    8.8 A

  • Drain-source On Resistance-Max:

    0.029 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    78 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

FDMS3572 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, with a voltage rating of 25V or higher. The capacitor should be placed as close to the VIN pin as possible.
  • Use a shielded enclosure, keep the layout compact, and minimize loop areas. Ensure proper grounding, decoupling, and filtering. Follow onsemi's EMI reduction guidelines and consult the application note AND9175/D.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device. Ensure the enable signal is within the recommended voltage range.

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FDMS3572 Overview

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