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FDMS7678 - onsemi

Description: Max rDS(on) = 6.8 mΩ at VGS = 4.5 V, ID = 15 A ; High performance technology for extremely low rDS(on) ; Max rDS(on) = 5.5 mΩ at VGS = 10 V, ID = 17.5 A ; RoHS Compliant ; Termination is Lead-free

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PCB Footprints
FDMS7678 - onsemi PCB footprint - Other - Other - PQFN8 5X6, 1.27P CASE 483AE ISSUE B
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3D Models
FDMS7678 - onsemi  - 3D model - Other - PQFN8 5X6, 1.27P CASE 483AE ISSUE B
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FDMS7678 Details

  • Manufacturer Part Number:

    FDMS7678

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    54 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    17.5 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    41 W

  • Pulsed Drain Current-Max (IDM):

    70 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS7678 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • A 10-22 μF X7R or X5R ceramic capacitor is recommended for the input filter. The capacitor value and type may vary depending on the specific application and noise requirements.
  • Use a shielded enclosure, keep the device and surrounding components away from the PCB edge, and implement a multi-layer PCB with a solid ground plane. Ensure proper decoupling and filtering of the input and output lines.
  • The maximum allowed voltage drop across the FDMS7678 is 0.5 V. Ensure that the input voltage is within the recommended range and that the device is operated within its specified current limits.

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FDMS7678 Overview

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