Part Image

FDMS86152 - onsemi

Description: Advanced Package and Silicon combination for low rDS(on) and high efficiency ; Max rDS(on) = 6 mΩ at VGS = 10 V, ID = 14 A ; Max rDS(on) = 11 mΩ at VGS = 6 V, ID = 11.5 A ; MSL1 robust package design ; RoHS Compliant ; 100% UIL tested

Download FDMS86152 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
FDMS86152 - onsemi PCB footprint - Other - Other - Power 56_2022
click to zoom
3D Models
FDMS86152 - onsemi  - 3D model - Other - Power 56_2022
click to zoom

FDMS86152 Details

  • Manufacturer Part Number:

    FDMS86152

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    541 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    14 A

  • Drain-source On Resistance-Max:

    0.006 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    260 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS86152 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures (above 125°C).
  • The maximum allowed voltage on the VCC pin is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and minimize power consumption.
  • Power up the VCC pin before the VIN pin, and ensure that the VCC pin reaches its operating voltage before applying a voltage to the VIN pin.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the VIN pin to ensure stable operation and minimize voltage ripple.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

FDMS86152 Overview

Use the download button to access the FDMS86152 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FDMS8, or try a keyword search, such as Power Field-Effect Transistors

Parts related to FDMS86152

Showing 0 results