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FDMS86250 - onsemi

Description: Shielded Gate MOSFET Technology; Max rDS(on) = 25 mΩ at VGS = 10 V, ID = 6.7 A; Max rDS(on) = 33 mΩ at VGS = 6 V, ID = 5.8 A; Advanced package and silicon combinatory for low rDS(on) and high efficiency; MSL1 robust package design; 100% UIL tested; RoHS Compliant

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PCB Footprints
FDMS86250 - onsemi PCB footprint - Other - Other - PQFN8 5x6,1.27P CASE 483AE ISSUE A
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3D Models
FDMS86250 - onsemi  - 3D model - Other - PQFN8 5x6,1.27P CASE 483AE ISSUE A
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FDMS86250 Details

  • Manufacturer Part Number:

    FDMS86250

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, PLASTIC, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Avalanche Energy Rating (Eas):

    180 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    6.7 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    96 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS86250 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDMS86250 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and ensure the device is operated within the specified voltage and current ranges.
  • A good PCB layout should prioritize thermal management, with a solid ground plane, minimal thermal resistance, and adequate heat sinking. Follow onsemi's recommended PCB layout guidelines and thermal management strategies for optimal performance.
  • To troubleshoot issues, start by verifying proper biasing, checking for thermal issues, and ensuring the device is operated within specified voltage and current ranges. Consult the datasheet and onsemi's application notes for guidance on troubleshooting common issues.
  • Follow standard ESD protection and handling procedures, such as using anti-static wrist straps, mats, and bags, and handling the device by the body rather than the leads. Consult onsemi's ESD handling guidelines for more information.

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FDMS86250 Overview

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