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FDMS86500DC - onsemi

Description: Dual Cool™ Top Side Cooling PQFN package; Max rDS(on) = 2.3 mΩ at VGS(on) = 10 V, ID = 29 A; Max rDS(on) = 3.3 mΩ at VGS(on) = 8 V, ID = 24 A; High performance technology for extremely low rDS(on); 100% UIL Tested; RoHS Compliant

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PCB Footprints
FDMS86500DC - onsemi PCB footprint - Other - Other - PQFN8 5X6, 1.27P CASE 483AE ISSUE A FFW_2020
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3D Models
FDMS86500DC - onsemi  - 3D model - Other - PQFN8 5X6, 1.27P CASE 483AE ISSUE A FFW_2020
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FDMS86500DC Details

  • Manufacturer Part Number:

    FDMS86500DC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN-8

  • Package Description:

    QFN-8

  • Manufacturer Package Code:

    506EG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    317 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    29 A

  • Drain-source On Resistance-Max:

    0.0023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS86500DC Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the VIN pin is 36V, but it's recommended to keep it below 30V for reliable operation and to prevent damage to the internal voltage regulator.
  • Yes, but ensure the device is properly sealed or coated to prevent moisture ingress. Also, follow the recommended storage and handling procedures to prevent moisture-related damage.
  • Check the input voltage, output load, and PCB layout. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any signs of oscillation or noise.

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FDMS86500DC Overview

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