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FDMS86540 - onsemi

Description: Max rDS(on) = 3.4 mΩ at VGS = 10 V, ID = 20 A; Max rDS(on) = 4.1 mΩ at VGS = 8 V, ID = 18.5 A; Advanced package and silicon combination for low rDS(on) and high efficiency; Next generation enhanced body diode technology, engineered for soft recovery; MSL1 robust package design; 100% UIL tested; RoHS Compliant

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PCB Footprints
FDMS86540 - onsemi PCB footprint - Other - Other - Power 56_2022
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3D Models
FDMS86540 - onsemi  - 3D model - Other - Power 56_2022
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FDMS86540 Details

  • Manufacturer Part Number:

    FDMS86540

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER 56, 8 PIN

  • Manufacturer Package Code:

    483AE

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    228 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.0034 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MO-240AA

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    96 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMS86540 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider using a thermal pad or thermal tape to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
  • The maximum allowed voltage on the VIN pin is 36V, but it's recommended to keep it below 30V for reliable operation and to prevent damage to the internal voltage regulator.
  • To configure the device for low-power mode, set the EN pin low, and ensure the VIN pin is below 5V. This will reduce the quiescent current and power consumption.
  • A 10uF to 22uF ceramic capacitor (X5R or X7R type) is recommended for the VIN pin to filter out noise and ensure stable operation.

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FDMS86540 Overview

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