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FDP025N06 - onsemi

Description: Low Gate Charge; RoHS compliant; High Power and Current Handling Capability; RDS(on) = 1.9mΩ ( Typ.) @ VGS = 10V, ID = 75A; High Performance Trench Technology for Extremely Low rDS(on); Fast Switching Speed

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PCB Footprints
FDP025N06 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 MOLDED 3,LEAD+
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3D Models
FDP025N06 - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 MOLDED 3,LEAD+
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FDP025N06 Details

  • Manufacturer Part Number:

    FDP025N06

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3

  • Package Description:

    TO-220, 3 PIN

  • Manufacturer Package Code:

    340AT

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    2531 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    395 W

  • Pulsed Drain Current-Max (IDM):

    1060 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDP025N06 Frequently Asked Questions (FAQs)

  • The maximum SOA for the FDP025N06 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. A safe operating area can be determined by plotting the device's voltage and current ratings against each other, taking into account the thermal resistance and maximum junction temperature.
  • To ensure the FDP025N06 is fully turned on, the gate-source voltage (Vgs) should be at least 4.5V, and the gate drive should be able to provide a current of at least 1A. Additionally, the gate resistance should be minimized to reduce the turn-on time.
  • The maximum allowed Vds for the FDP025N06 is 60V, as specified in the datasheet. Exceeding this voltage can lead to device damage or failure.
  • Thermal management is critical for the FDP025N06. Ensure good thermal contact between the device and the heat sink, and use a heat sink with a thermal resistance of less than 10°C/W. Also, consider using a thermal interface material to reduce thermal resistance.
  • The maximum allowed power dissipation for the FDP025N06 is dependent on the ambient temperature and the thermal resistance of the device. A general rule of thumb is to limit the power dissipation to 1W or less for reliable operation.

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