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FDP52N20 - onsemi

Description: Low gate charge ( Typ. 49nC); RoHS compliant; Low Crss ( Typ. 66pF); RDS(on) = 41mΩ ( Typ.)@ VGS = 10V, ID = 26A; 100% avalanche tested

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FDP52N20 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 3L_1
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FDP52N20 - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 3L_1
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FDP52N20 Details

  • Manufacturer Part Number:

    FDP52N20

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220-3

  • Package Description:

    TO-220, 3 PIN

  • Manufacturer Package Code:

    340AT

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.92

  • Additional Feature:

    AVALANCHE ENERGY RATED

  • Avalanche Energy Rating (Eas):

    2520 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    52 A

  • Drain-source On Resistance-Max:

    0.049 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    357 W

  • Pulsed Drain Current-Max (IDM):

    208 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDP52N20 Frequently Asked Questions (FAQs)

  • The maximum junction temperature of the FDP52N20 is 175°C. Exceeding this temperature can lead to device failure.
  • To ensure proper biasing, the FDP52N20 requires a gate-source voltage (Vgs) between 2V and 10V, and a drain-source voltage (Vds) not exceeding 200V. Additionally, the device should be operated within the recommended operating area to prevent overheating.
  • The recommended gate resistor value for the FDP52N20 is between 1kΩ and 10kΩ. A higher value can lead to slower switching times, while a lower value can cause excessive gate current.
  • Yes, the FDP52N20 is suitable for high-frequency switching applications up to 1 MHz. However, the device's switching characteristics, such as rise and fall times, should be considered to ensure optimal performance.
  • To protect the FDP52N20 from ESD, handle the device with anti-static wrist straps, mats, or bags. Additionally, ensure that the device is stored in a conductive container or bag to prevent static buildup.

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FDP52N20 Overview

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Part Image FDP52N20 Fairchild Semiconductor Corporation

Power Field-Effect Transistor, 52A I(D), 200V, 0.049ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB