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FDPC8016S - onsemi

Description: Q1 N-Channel Max. RDS(on) = 3.8 mΩ at VGS = 10 V, ID = 20 A Max. RDS(on) = 4.7 mΩ at VGS = 4.5 V, ID = 18 A; Low inductance packaging shortens rise/fall times, resulting in lower switching losses; RoHS Compliant; Q2 N-Channel Max. RDS(on) = 1.4 mΩ at VGS = 10 V, ID = 35 A Max. RDS(on) = 1.7 mΩ at VGS = 4.5 V, ID = 32 A; MOSFET integration enables optimum layout for lower circuit inductance and reduced switch node ringing

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PCB Footprints
FDPC8016S - onsemi PCB footprint - Other - Other - PQFN8 5.00x6.00x0.75, 1.27P CASE 483AR ISSUE D
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3D Models
FDPC8016S - onsemi  - 3D model - Other - PQFN8 5.00x6.00x0.75, 1.27P CASE 483AR ISSUE D
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FDPC8016S Details

  • Manufacturer Part Number:

    FDPC8016S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-8

  • Manufacturer Package Code:

    483AR

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    73 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.0038 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    42 W

  • Pulsed Drain Current-Max (IDM):

    75 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDPC8016S Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for reliable operation and to prevent damage to the internal voltage regulator.
  • Yes, the FDPC8016S is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions and design guidelines.
  • Use a logic analyzer or oscilloscope to monitor the device's pins and signals. Check the input voltage, output voltage, and current consumption. Also, verify that the device is properly configured and that the PCB layout is correct.

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FDPC8016S Overview

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