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FDS4559-F085 - onsemi

Description: RoHS Compliant; Qualified to AEC Q101; Q2 P-Channel -3.5A, -60V Max. RDS(on) = 105 mΩ at VGS = -10 V Max. RDS(on) = 135 mΩ at VGS = -4.5 V; Q1 N-Channel 4.5A, 60V Max. RDS(on) = 55 mΩ at VGS = 10 V, Max. RDS(on) = 75 mΩ at VGS = 4.5 V

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FDS4559-F085 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - soic-8_2020
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FDS4559-F085 - onsemi  - 3D model - Small Outline Packages - soic-8_2020
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FDS4559-F085 Details

  • Manufacturer Part Number:

    FDS4559-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SO 8L NB

  • Package Description:

    ROHS COMPLIANT, SOP-8

  • Manufacturer Package Code:

    751EB

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS4559-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • A gate drive voltage of 10-12V is recommended for optimal switching performance. However, ensure the gate drive voltage does not exceed the maximum rating of 15V.
  • Use a shielded cable for the gate drive signal, keep the gate drive circuitry close to the device, and ensure a low-impedance return path for the gate drive current. Additionally, consider adding EMI filters or shielding to the PCB.
  • The maximum allowed voltage transient during turn-on and turn-off is 50V/us. Exceeding this limit may cause device damage or malfunction.

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FDS4559-F085 Overview

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